In terms of things like architecture and fab process; the fanciest Epycs you can buy don’t differ much from the chiplet-based Ryzens; and the MI250X is only slightly ahead, in process terms(TSMC 6nm vs 7nm) of Radeon and Radeon Pro parts; just a much bigger device with a lot more HBM.

Compare to, say, machine tools, where your harbor freight drill press and some big, mean, ITAR-controlled, aerospace CNC gear might as well be from different planets.

The biggest difference, as seems to be common with HPC, is interconnect; it is ethernet-based in this case; but the big cluster systems do tend to have genuinely somewhat exotic and atypically capable interconnects vs. consumer gear or even commodity datacenter stuff.